Detail publikace

Interconnection of the back side contact solar cell and the ceramic substrate

Originální název

Interconnection of the back side contact solar cell and the ceramic substrate

Anglický název

Interconnection of the back side contact solar cell and the ceramic substrate

Jazyk

en

Originální abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step.

Anglický abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step.

BibTex


@inproceedings{BUT18877,
  author="Luboš {Jakubka} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Interconnection of the back side contact solar cell and the ceramic substrate",
  annote="This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step.",
  address="Darko Belavič",
  booktitle="4th European Microelectronics and Packaging Symposium, EMPS 2006 Proceedings",
  chapter="18877",
  institution="Darko Belavič",
  year="2006",
  month="january",
  pages="387",
  publisher="Darko Belavič",
  type="conference paper"
}