Publication detail

Interconnection of the back side contact solar cell and the ceramic substrate

Jakubka,L., Novotny,M., Szendiuch,I.

Original Title

Interconnection of the back side contact solar cell and the ceramic substrate

Type

conference paper

Language

English

Original Abstract

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step.

Key words in English

Interconnection, Back Side Contact Solar Cell, Reliability

Authors

Jakubka,L., Novotny,M., Szendiuch,I.

RIV year

2006

Released

1. 1. 2006

Publisher

Darko Belavič

Location

Ljubljana

ISBN

961-91023-4-7

Book

4th European Microelectronics and Packaging Symposium, EMPS 2006 Proceedings

Edition number

první

Pages from

387

Pages to

390

Pages count

4

BibTex

@inproceedings{BUT18877,
  author="Luboš {Jakubka} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Interconnection of the back side contact solar cell and the ceramic substrate",
  booktitle="4th European Microelectronics and Packaging Symposium, EMPS 2006 Proceedings",
  year="2006",
  number="první",
  pages="4",
  publisher="Darko Belavič",
  address="Ljubljana",
  isbn="961-91023-4-7"
}