Detail publikace

Gas flow and heat transfer in reflow oven

Originální název

Gas flow and heat transfer in reflow oven

Anglický název

Gas flow and heat transfer in reflow oven

Jazyk

en

Originální abstrakt

Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.

Anglický abstrakt

Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.

BibTex


@inproceedings{BUT152057,
  author="Ivan {Szendiuch} and Edita {Hejátková} and Milan {Hurban}",
  title="Gas flow and heat transfer in reflow oven",
  annote="Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.",
  address="IEEE Computer Society",
  booktitle="2018 41st International Spring Seminar on Electronics Technology",
  chapter="152057",
  doi="10.1109/ISSE.2018.8443763",
  howpublished="electronic, physical medium",
  institution="IEEE Computer Society",
  number="1",
  year="2018",
  month="august",
  pages="254--256",
  publisher="IEEE Computer Society",
  type="conference paper"
}