Publication detail

Gas flow and heat transfer in reflow oven

SZENDIUCH, I. HEJÁTKOVÁ, E. HURBAN, M.

Original Title

Gas flow and heat transfer in reflow oven

Type

conference paper

Language

English

Original Abstract

Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.

Keywords

Reflow soldering, heat transfer coefficient, gas flow, 3D flow measuring.

Authors

SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M.

Released

8. 8. 2018

Publisher

IEEE Computer Society

Location

Zlatibor, Serbia

ISBN

2161-2536

Periodical

International Spring Seminar on Electronics Technology ISSE

Year of study

1

Number

1

State

United States of America

Pages from

254

Pages to

256

Pages count

3

URL

http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919

BibTex

@inproceedings{BUT152057,
  author="Ivan {Szendiuch} and Edita {Hejátková} and Milan {Hurban}",
  title="Gas flow and heat transfer in reflow oven",
  booktitle="2018 41st International Spring Seminar on Electronics Technology",
  year="2018",
  journal="International Spring Seminar on Electronics Technology ISSE",
  volume="1",
  number="1",
  pages="254--256",
  publisher="IEEE Computer Society",
  address="Zlatibor, Serbia",
  doi="10.1109/ISSE.2018.8443763",
  issn="2161-2536",
  url="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919"
}