Publication detail

A Novel Laboratory Anodic Bonding Device for MEMS Applications

HÁZE, J. VRBA, R. PAVLÍK, M. PEKÁREK, J.

Original Title

A Novel Laboratory Anodic Bonding Device for MEMS Applications

English Title

A Novel Laboratory Anodic Bonding Device for MEMS Applications

Type

journal article - other

Language

en

Original Abstract

The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

English abstract

The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Keywords

anodic bonding, MEMS

RIV year

2010

Released

07.12.2010

Publisher

ZCU Plzeň

Location

Plzeň

Pages from

24

Pages to

26

Pages count

3

BibTex


@article{BUT50401,
  author="Jiří {Háze} and Radimír {Vrba} and Michal {Pavlík} and Jan {Pekárek}",
  title="A Novel Laboratory Anodic Bonding Device for MEMS Applications",
  annote="The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.",
  address="ZCU Plzeň",
  chapter="50401",
  institution="ZCU Plzeň",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  number="3",
  volume="2010",
  year="2010",
  month="december",
  pages="24--26",
  publisher="ZCU Plzeň",
  type="journal article - other"
}