Detail publikace

A Novel Laboratory Anodic Bonding Device for MEMS Applications

Originální název

A Novel Laboratory Anodic Bonding Device for MEMS Applications

Anglický název

A Novel Laboratory Anodic Bonding Device for MEMS Applications

Jazyk

en

Originální abstrakt

The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Anglický abstrakt

The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Dokumenty

BibTex


@article{BUT50401,
  author="Jiří {Háze} and Radimír {Vrba} and Michal {Pavlík} and Jan {Pekárek}",
  title="A Novel Laboratory Anodic Bonding Device for MEMS Applications",
  annote="The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.",
  address="ZCU Plzeň",
  chapter="50401",
  institution="ZCU Plzeň",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  number="3",
  volume="2010",
  year="2010",
  month="december",
  pages="24--26",
  publisher="ZCU Plzeň",
  type="journal article - other"
}