Publication detail

Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

SCHNEDERLE, P. ADÁMEK, M. SZENDIUCH, I.

Original Title

Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

English Title

Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

Type

conference paper

Language

en

Original Abstract

An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste was used as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical package as well as BGA and CSP package.

English abstract

An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste was used as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical package as well as BGA and CSP package.

Keywords

soldering, lead-free, nitrogen

RIV year

2012

Released

13.05.2012

Publisher

Vienna University of Technology

Location

Gusshausstrasse 27- 29, A-1040 WIEN - Austria: IEEE Xplore digital library

ISBN

978-1-4673-2241-6

Book

35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings

Edition

1

Edition number

1

Pages from

201

Pages to

206

Pages count

5

URL

BibTex


@inproceedings{BUT92353,
  author="Petr {Schnederle} and Martin {Adámek} and Ivan {Szendiuch}",
  title="Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders",
  annote="An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste was used as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical package as well as BGA and CSP package.",
  address="Vienna University of Technology",
  booktitle="35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings",
  chapter="92353",
  edition="1",
  howpublished="print",
  institution="Vienna University of Technology",
  number="1",
  year="2012",
  month="may",
  pages="201--206",
  publisher="Vienna University of Technology",
  type="conference paper"
}