Detail publikace

Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

SCHNEDERLE, P. ADÁMEK, M. SZENDIUCH, I.

Originální název

Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste was used as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical package as well as BGA and CSP package.

Klíčová slova

soldering, lead-free, nitrogen

Autoři

SCHNEDERLE, P.; ADÁMEK, M.; SZENDIUCH, I.

Rok RIV

2012

Vydáno

13. 5. 2012

Nakladatel

Vienna University of Technology

Místo

Gusshausstrasse 27- 29, A-1040 WIEN - Austria: IEEE Xplore digital library

ISBN

978-1-4673-2241-6

Kniha

35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings

Edice

1

Číslo edice

1

ISSN

2161-2528

Periodikum

Electronics Technology (ISSE)

Ročník

35

Číslo

1

Stát

Spojené státy americké

Strany od

201

Strany do

206

Strany počet

5

URL

http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273139

BibTex

@inproceedings{BUT92353,
  author="Petr {Schnederle} and Martin {Adámek} and Ivan {Szendiuch}",
  title="Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders",
  booktitle="35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings",
  year="2012",
  series="1",
  journal="Electronics Technology (ISSE)",
  volume="35",
  number="1",
  pages="201--206",
  publisher="Vienna University of Technology",
  address="Gusshausstrasse 27- 29, A-1040 WIEN - Austria: IEEE Xplore digital library",
  isbn="978-1-4673-2241-6",
  issn="2161-2528",
  url="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273139"
}