Publication detail

Recent advance in solder ball interconnections reliability examination

ŠVECOVÁ, O. NICÁK, M. ŠANDERA, J. KOSINA, P.

Original Title

Recent advance in solder ball interconnections reliability examination

Type

conference paper

Language

English

Original Abstract

This article describes recent advance in research of reliability of lead-free (SAC 305) ball interconnections between electronic modules and base printed circuit boards. Alternative methods such as finite element method, which is being widely used in simulation software Ansys and by Coffin-Manson's fatigue model. Recent calculations concur to statistic-based evaluation of earlier experiments, which proved greater reliability of solder joints created on alumina substrates.

Keywords

Lead-free solder, solder joint, reliability and fatigue models

Authors

ŠVECOVÁ, O.; NICÁK, M.; ŠANDERA, J.; KOSINA, P.

RIV year

2011

Released

11. 5. 2011

Publisher

Technická Univerzita Košice

Location

Košice, SK

ISBN

978-1-4577-2111-3

Book

ISSE 2011 - PROCEEDINGS

Edition

1.

Edition number

1

ISBN

2161-2528

Periodical

Electronics Technology (ISSE)

State

United States of America

Pages from

253

Pages to

257

Pages count

4

URL

http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560

BibTex

@inproceedings{BUT74392,
  author="Olga {Švecová} and Michal {Nicák} and Josef {Šandera} and Petr {Kosina}",
  title="Recent advance in solder ball interconnections reliability examination",
  booktitle="ISSE 2011 - PROCEEDINGS",
  year="2011",
  series="1.",
  journal="Electronics Technology (ISSE)",
  number="1",
  pages="253--257",
  publisher="Technická Univerzita Košice",
  address="Košice, SK",
  isbn="978-1-4577-2111-3",
  issn="2161-2528",
  url="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560"
}