Detail publikace

Recent advance in solder ball interconnections reliability examination

Originální název

Recent advance in solder ball interconnections reliability examination

Anglický název

Recent advance in solder ball interconnections reliability examination

Jazyk

en

Originální abstrakt

This article describes recent advance in research of reliability of lead-free (SAC 305) ball interconnections between electronic modules and base printed circuit boards. Alternative methods such as finite element method, which is being widely used in simulation software Ansys and by Coffin-Manson's fatigue model. Recent calculations concur to statistic-based evaluation of earlier experiments, which proved greater reliability of solder joints created on alumina substrates.

Anglický abstrakt

This article describes recent advance in research of reliability of lead-free (SAC 305) ball interconnections between electronic modules and base printed circuit boards. Alternative methods such as finite element method, which is being widely used in simulation software Ansys and by Coffin-Manson's fatigue model. Recent calculations concur to statistic-based evaluation of earlier experiments, which proved greater reliability of solder joints created on alumina substrates.

BibTex


@inproceedings{BUT74392,
  author="Olga {Švecová} and Michal {Nicák} and Josef {Šandera} and Petr {Kosina}",
  title="Recent advance in solder ball interconnections reliability examination",
  annote="This article describes recent advance in research of reliability of lead-free (SAC 305) ball interconnections between electronic modules and base printed circuit boards. Alternative methods such as finite element method, which is being widely used in simulation software Ansys and by Coffin-Manson's fatigue model. Recent calculations concur to statistic-based evaluation of earlier experiments, which proved greater reliability of solder joints created on alumina substrates.",
  address="Technická Univerzita Košice",
  booktitle="ISSE 2011 - PROCEEDINGS",
  chapter="74392",
  edition="1.",
  howpublished="print",
  institution="Technická Univerzita Košice",
  year="2011",
  month="may",
  pages="253--257",
  publisher="Technická Univerzita Košice",
  type="conference paper"
}