Publication detail
Modeling of Microelectronic Structures and Packages using ANSYS Software
PSOTA, B. SZENDIUCH, I.
Original Title
Modeling of Microelectronic Structures and Packages using ANSYS Software
English Title
Modeling of Microelectronic Structures and Packages using ANSYS Software
Type
conference proceedings
Language
en
Original Abstract
This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.
English abstract
This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.
Keywords
Mechanical stress, ANSYS, BGA, Simulation
Released
16.05.2011
ISBN
978-1-4577-2111-3
Documents
BibTex
@proceedings{BUT73010,
author="Boleslav {Psota} and Ivan {Szendiuch}",
title="Modeling of Microelectronic Structures and Packages using ANSYS Software",
annote="This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is
shown the comparison of three different solders and described their usage for electronic components.",
chapter="73010",
year="2011",
month="may",
type="conference proceedings"
}