Publication detail

Modeling of Microelectronic Structures and Packages using ANSYS Software

PSOTA, B. SZENDIUCH, I.

Original Title

Modeling of Microelectronic Structures and Packages using ANSYS Software

English Title

Modeling of Microelectronic Structures and Packages using ANSYS Software

Type

conference proceedings

Language

en

Original Abstract

This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.

English abstract

This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.

Keywords

Mechanical stress, ANSYS, BGA, Simulation

Released

16.05.2011

ISBN

978-1-4577-2111-3

Documents

BibTex 


@proceedings{BUT73010,
  author="Boleslav {Psota} and Ivan {Szendiuch}",
  title="Modeling of Microelectronic Structures and Packages using ANSYS Software",
  annote="This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is
shown the comparison of three different solders and described their usage for electronic components.",
  chapter="73010",
  year="2011",
  month="may",
  type="conference proceedings"
}