Detail publikace
Modeling of Microelectronic Structures and Packages using ANSYS Software
PSOTA, B. SZENDIUCH, I.
Originální název
Modeling of Microelectronic Structures and Packages using ANSYS Software
Anglický název
Modeling of Microelectronic Structures and Packages using ANSYS Software
Jazyk
en
Originální abstrakt
This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.
Anglický abstrakt
This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.
Dokumenty
BibTex
@proceedings{BUT73010,
author="Boleslav {Psota} and Ivan {Szendiuch}",
title="Modeling of Microelectronic Structures and Packages using ANSYS Software",
annote="This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is
shown the comparison of three different solders and described their usage for electronic components.",
chapter="73010",
year="2011",
month="may",
type="conference proceedings"
}