Detail publikace

Modeling of Microelectronic Structures and Packages using ANSYS Software

PSOTA, B. SZENDIUCH, I.

Originální název

Modeling of Microelectronic Structures and Packages using ANSYS Software

Typ

konferenční sborník (ne článek)

Jazyk

angličtina

Originální abstrakt

This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.

Klíčová slova

Mechanical stress, ANSYS, BGA, Simulation

Autoři

PSOTA, B.; SZENDIUCH, I.

Vydáno

16. 5. 2011

ISBN

978-1-4577-2111-3

BibTex

@proceedings{BUT73010,
  editor="Boleslav {Psota} and Ivan {Szendiuch}",
  title="Modeling of Microelectronic Structures and Packages using ANSYS Software",
  year="2011",
  isbn="978-1-4577-2111-3"
}