Publication detail

Chip Level Packaging - New Way to Higher Integration

SZENDIUCH, I.

Original Title

Chip Level Packaging - New Way to Higher Integration

English Title

Chip Level Packaging - New Way to Higher Integration

Type

journal article - other

Language

en

Original Abstract

see paper

English abstract

see paper

RIV year

2002

Released

23.06.2001

Pages from

9

Pages to

14

Pages count

6

BibTex


@article{BUT40589,
  author="Ivan {Szendiuch}",
  title="Chip Level Packaging - New Way to Higher Integration",
  annote="see paper",
  chapter="40589",
  journal="Bulletin anotací SMT info 10/01",
  number="33",
  volume="06",
  year="2001",
  month="june",
  pages="9",
  type="journal article - other"
}