Publication detail

Chip Level Packaging - New Way to Higher Integration

SZENDIUCH, I.

Original Title

Chip Level Packaging - New Way to Higher Integration

Type

journal article - other

Language

English

Original Abstract

see paper

Key words in English

chip level packaging, integration

Authors

SZENDIUCH, I.

RIV year

2002

Released

23. 6. 2001

Pages from

9

Pages to

14

Pages count

6

BibTex

@{BUT70869
}