Detail publikace

Chip Level Packaging - New Way to Higher Integration

Originální název

Chip Level Packaging - New Way to Higher Integration

Anglický název

Chip Level Packaging - New Way to Higher Integration

Jazyk

en

Originální abstrakt

see paper

Anglický abstrakt

see paper

BibTex


@article{BUT40589,
  author="Ivan {Szendiuch}",
  title="Chip Level Packaging - New Way to Higher Integration",
  annote="see paper",
  chapter="40589",
  journal="Bulletin anotací SMT info 10/01",
  number="33",
  volume="06",
  year="2001",
  month="june",
  pages="9",
  type="journal article"
}