Publication detail

New Facts from Lead-free Solders Reliability Investigation

BURŠÍK, M. SZENDIUCH, I. JANKOVSKÝ, J. HEJÁTKOVÁ, E.

Original Title

New Facts from Lead-free Solders Reliability Investigation

English Title

New Facts from Lead-free Solders Reliability Investigation

Type

conference paper

Language

en

Original Abstract

The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.

English abstract

The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.

Keywords

Lead-free, reliability, solder, structure

RIV year

2010

Released

13.09.2010

Location

Berlín, Německo

ISBN

978-1-4244-8555-0

Book

Electronics System Integration Technology Conference ESTC 2010 in Berlin

Edition

1

Edition number

1

Pages from

101

Pages to

105

Pages count

5

BibTex


@inproceedings{BUT35244,
  author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Edita {Hejátková}",
  title="New Facts from Lead-free Solders Reliability Investigation",
  annote="The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.",
  booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
  chapter="35244",
  edition="1",
  howpublished="print",
  year="2010",
  month="september",
  pages="101--105",
  type="conference paper"
}