Detail publikace

New Facts from Lead-free Solders Reliability Investigation

Originální název

New Facts from Lead-free Solders Reliability Investigation

Anglický název

New Facts from Lead-free Solders Reliability Investigation

Jazyk

en

Originální abstrakt

The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.

Anglický abstrakt

The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.

Dokumenty

BibTex


@inproceedings{BUT35244,
  author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Edita {Hejátková}",
  title="New Facts from Lead-free Solders Reliability Investigation",
  annote="The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.",
  booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
  chapter="35244",
  edition="1",
  howpublished="print",
  year="2010",
  month="september",
  pages="101--105",
  type="conference paper"
}