Publication detail

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

SZENDIUCH, I. NOVOTNÝ, M. BARTOŇ, Z.

Original Title

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

English Title

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

Type

conference paper

Language

en

Original Abstract

study of wire bonding connection for power chips

English abstract

study of wire bonding connection for power chips

Keywords

wire bonding for high current

RIV year

2007

Released

23.10.2007

Location

Cairo

ISBN

978-1-4244-1824-4

Book

Proceedings IDT'07

Edition number

1

Pages from

242

Pages to

245

Pages count

4

BibTex


@inproceedings{BUT28219,
  author="Ivan {Szendiuch} and Marek {Novotný} and Zdeněk {Bartoň}",
  title="Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections",
  annote="study of wire bonding connection for power chips",
  booktitle="Proceedings IDT'07",
  chapter="28219",
  year="2007",
  month="october",
  pages="242--245",
  type="conference paper"
}