Detail publikace

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

SZENDIUCH, I. NOVOTNÝ, M. BARTOŇ, Z.

Originální název

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

study of wire bonding connection for power chips

Klíčová slova

wire bonding for high current

Autoři

SZENDIUCH, I.; NOVOTNÝ, M.; BARTOŇ, Z.

Rok RIV

2007

Vydáno

23. 10. 2007

Místo

Cairo

ISBN

978-1-4244-1824-4

Kniha

Proceedings IDT'07

Číslo edice

1

Strany od

242

Strany do

245

Strany počet

4

BibTex

@inproceedings{BUT28219,
  author="Ivan {Szendiuch} and Marek {Novotný} and Zdeněk {Bartoň}",
  title="Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections",
  booktitle="Proceedings IDT'07",
  year="2007",
  number="1",
  pages="242--245",
  address="Cairo",
  isbn="978-1-4244-1824-4"
}