Publication detail

Optimizing of PCBA cleaning process through process calibration tools

BURŠÍK, M. SZENDIUCH, I. JANKOVSKÝ, J. ŘEZNÍČEK, M.

Original Title

Optimizing of PCBA cleaning process through process calibration tools

English Title

Optimizing of PCBA cleaning process through process calibration tools

Type

conference paper

Language

en

Original Abstract

The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.

English abstract

The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.

Keywords

Cleaning, PCB, efficiency, calibration tool

RIV year

2013

Released

12.09.2013

Publisher

IEEE

Location

Grenoble. France

ISBN

978-2-9527467-1-7

Book

EMPC 2013

Edition

2013

Edition number

1

Pages from

1

Pages to

3

Pages count

4

URL

BibTex


@inproceedings{BUT104207,
  author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Michal {Řezníček}",
  title="Optimizing of PCBA cleaning process through process calibration tools",
  annote="The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.",
  address="IEEE",
  booktitle="EMPC 2013",
  chapter="104207",
  edition="2013",
  howpublished="electronic, physical medium",
  institution="IEEE",
  year="2013",
  month="september",
  pages="1--3",
  publisher="IEEE",
  type="conference paper"
}