Detail publikace
Optimizing of PCBA cleaning process through process calibration tools
Originální název
Optimizing of PCBA cleaning process through process calibration tools
Anglický název
Optimizing of PCBA cleaning process through process calibration tools
Jazyk
en
Originální abstrakt
The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.
Anglický abstrakt
The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.
BibTex
@inproceedings{BUT104207,
author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Michal {Řezníček}",
title="Optimizing of PCBA cleaning process through process calibration tools",
annote="The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.",
address="IEEE",
booktitle="EMPC 2013",
chapter="104207",
edition="2013",
howpublished="electronic, physical medium",
institution="IEEE",
year="2013",
month="september",
pages="1--3",
publisher="IEEE",
type="conference paper"
}