Detail publikace

Optimizing of PCBA cleaning process through process calibration tools

BURŠÍK, M. SZENDIUCH, I. JANKOVSKÝ, J. ŘEZNÍČEK, M.

Originální název

Optimizing of PCBA cleaning process through process calibration tools

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.

Klíčová slova

Cleaning, PCB, efficiency, calibration tool

Autoři

BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J.; ŘEZNÍČEK, M.

Rok RIV

2013

Vydáno

12. 9. 2013

Nakladatel

IEEE

Místo

Grenoble. France

ISBN

978-2-9527467-1-7

Kniha

EMPC 2013

Edice

2013

Číslo edice

1

Strany od

1

Strany do

3

Strany počet

4

URL

http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6698652

BibTex

@inproceedings{BUT104207,
  author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Michal {Řezníček}",
  title="Optimizing of PCBA cleaning process through process calibration tools",
  booktitle="EMPC 2013",
  year="2013",
  series="2013",
  number="1",
  pages="1--3",
  publisher="IEEE",
  address="Grenoble. France",
  isbn="978-2-9527467-1-7",
  url="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6698652"
}