Detail publikace

Optimizing of PCBA cleaning process through process calibration tools

BURŠÍK, M. SZENDIUCH, I. JANKOVSKÝ, J. ŘEZNÍČEK, M.

Originální název

Optimizing of PCBA cleaning process through process calibration tools

Anglický název

Optimizing of PCBA cleaning process through process calibration tools

Jazyk

en

Originální abstrakt

The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.

Anglický abstrakt

The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.

Dokumenty

BibTex 


@inproceedings{BUT104207,
  author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Michal {Řezníček}",
  title="Optimizing of PCBA cleaning process through process calibration tools",
  annote="The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems.",
  address="IEEE",
  booktitle="EMPC 2013",
  chapter="104207",
  edition="2013",
  howpublished="electronic, physical medium",
  institution="IEEE",
  year="2013",
  month="september",
  pages="1--3",
  publisher="IEEE",
  type="conference paper"
}