Publication detail

Study of Atmosphere Influence on BGA Solder Balls Process

OTÁHAL, A. SZENDIUCH, I.

Original Title

Study of Atmosphere Influence on BGA Solder Balls Process

English Title

Study of Atmosphere Influence on BGA Solder Balls Process

Type

journal article - other

Language

en

Original Abstract

This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.

English abstract

This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.

Keywords

shear strength, solder ball, reflow, vapor soldering, nitrogen atmosphere

RIV year

2013

Released

26.06.2013

Publisher

UAB

Location

Alba Iiulia

Pages from

121

Pages to

126

Pages count

6

BibTex


@article{BUT100913,
  author="Alexandr {Otáhal} and Ivan {Szendiuch}",
  title="Study of Atmosphere Influence on BGA Solder Balls Process",
  annote="This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.",
  address="UAB",
  chapter="100913",
  howpublished="electronic, physical medium",
  institution="UAB",
  number="2013",
  volume="36",
  year="2013",
  month="june",
  pages="121--126",
  publisher="UAB",
  type="journal article - other"
}