Detail publikace

Study of Atmosphere Influence on BGA Solder Balls Process

OTÁHAL, A. SZENDIUCH, I.

Originální název

Study of Atmosphere Influence on BGA Solder Balls Process

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.

Klíčová slova

shear strength, solder ball, reflow, vapor soldering, nitrogen atmosphere

Autoři

OTÁHAL, A.; SZENDIUCH, I.

Rok RIV

2013

Vydáno

26. 6. 2013

Nakladatel

UAB

Místo

Alba Iiulia

ISSN

2161-2528

Periodikum

Electronics Technology (ISSE)

Ročník

36

Číslo

2013

Stát

Spojené státy americké

Strany od

121

Strany do

126

Strany počet

6

BibTex

@article{BUT100913,
  author="Alexandr {Otáhal} and Ivan {Szendiuch}",
  title="Study of Atmosphere Influence on BGA Solder Balls Process",
  journal="Electronics Technology (ISSE)",
  year="2013",
  volume="36",
  number="2013",
  pages="121--126",
  issn="2161-2528"
}