Project detail

Aplikace časoprostorové reciprocity ve výpočetní elektromagnetické kompatibilitě

Duration: 02.01.2017 — 31.12.2018

On the project

Stále se zvyšující integrace a stále klesající odolnost elektronických digitálních systémů si naléhavě vyžadují vývoj přístupů v časové oblasti, které jsou schopny vyhodnotit možné transientní zdroje elektromagnetické interference (EMI) a tím zabezpečit bezproblémovou koexistenci a bezpečný provoz takových systémů. Tento projekt tudíž cílí na využití jedinečné odborné znalosti ve vývoji nových časoprostorových metod pro efektivní řešení problémů EMI, odolnosti a napájecí/signálové integrity v časové oblasti.

Keywords
elektromagnetická kompatibilita;modelování v časové oblasti;princip reciprocity

Key words in English
electromagnetic compatibility; time-domain modeling; reciprocity theorems

Mark

GJ17-05445Y

Default language

Czech

People responsible

Štumpf Martin, doc. Ing., Ph.D.
- principal person responsible (2017-01-02 - 2018-12-31)
Kadlec Petr, Ing., Ph.D.
- fellow researcher (2017-01-02 - 2018-12-31)
Šeděnka Vladimír, Ing., Ph.D.
- fellow researcher (2017-01-02 - 2018-12-31)

Units

Department of Radioengineering
- (2017-01-02 - not assigned)
division-REL-SIX
- (2017-01-02 - 2018-12-31)

Funding resources

Czech Science Foundation - Juniorské granty

- whole funder (2017-01-02 - 2018-12-31)

Results

ŠTUMPF, M. A Generalization of the Time-Domain Cooray–Rubinstein Formula. IEEE Transaction on Electromagnetic Compatibility, 2017, vol. 59, no. 5, p. 1-4. ISSN: 0018-9375.
Detail

ŠTUMPF, M.; ANTONINI, G. Electromagnetic Field Coupling to a Transmission Line -- A Reciprocity-Based Approach. IEEE Transaction on Electromagnetic Compatibility, 2019, vol. 61, no. 6, p. 1-9. ISSN: 0018-9375.
Detail

KADLEC, P.; ŠEDĚNKA, V.; ŠTUMPF, M.; MAREK, M. Solution of an Inverse Scattering Problem Using Optimization with a Variable Number of Dimensions. In 2017 International Conference on Electromagnetics in Advanced Applications (ICEAA). 19. Verona, Italy: Politechnico di Torino, 2017. p. 976-979. ISBN: 978-1-5090-4450-4.
Detail

ŠTUMPF, M.; ŠEDĚNKA, V.; KADLEC, P. On Modeling of Excitation Ports in the Time-Domain Contour-Integral Method. In Proceedings of the 2017 International Conference on Electromagnetics in Advanced Applications (ICEAA). 19th Edition. Verona, Italy: 2017. p. 1292-1294. ISBN: 978-1-5090-4450-4.
Detail

ŠTUMPF, M. Coupling of Impulsive EM Plane-Wave Fields to Narrow Conductive Strips: An Analysis Based on the Concept of External Impedance. IEEE Transaction on Electromagnetic Compatibility, 2017, vol. 60, no. 2, p. 548-551. ISSN: 0018-9375.
Detail

ŠTUMPF, M. Electromagnetic Reciprocity in Antenna Theory. Hoboken, NJ, USA: IEEE-Wiley Press, 2017. 130 p. ISBN: 978-1-119-46637-6.
Detail

ŠTUMPF, M. The Time-Domain Compensation Theorem and Its Application to Pulsed EM Scattering of Multiport Receiving Antennas. IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2018, vol. 66, no. 1, p. 226-232. ISSN: 0018-926X.
Detail

KADLEC, P.; ŠEDĚNKA, V.; MAREK, M.; ŠTUMPF, M. Optimizing a Decoupling Capacitor on a PCB: A Fully Time-Domain Approach Based on PSO and TD-CIM. In ELECTROMAGNETIC COMPATIBILITY. INTERNATIONAL SYMPOSIUM. 2018. (EMC EUROPE 2018). 2018. Amsterdam, Nizozemsko: IEEE, 2018. p. 134-138. ISBN: 9781467396998.
Detail

ŠTUMPF, M. Controlling Pulsed EM Scattering of a One-Port Receiving Antenna. RADIO SCIENCE, 2018, vol. 52, no. 12, p. 1596-1603. ISSN: 1944-799X.
Detail

ŠTUMPF, M. Pulsed EM Field Computation in Planar Circuits: The Contour Integral Method. Boca Raton, FL, USA: CRC Press, 2018. 244 p. ISBN: 9781138735248.
Detail

ŠTUMPF, M.; VANDENBOSCH, G.; LAGER, I. Modified Kirchhoff Diffraction of Pulsed EM Waves Radiated from a Slot-Excited Fabry-Pérot Resonator Antenna. In Proceedings of the 12th European Conference on Antennas and Propagation. 2018. p. 1-4. ISBN: 9781509037421.
Detail

ŠTUMPF, M. The Time-Domain Compensation Contour Integral Method (TD-C2IM) – A New Approach to the Analysis of Irregularly-Shaped Parallel-Plane Circuits. In Proceedings of 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity. Long Beach, CA: IEEE EMC Society, 2018. p. 161-164. ISBN: 978-1-5386-6620-3.
Detail

ŠTUMPF, M. Pulsed Vertical-Electric-Dipole Excited Voltages on Transmission Lines Over a Perfect Ground—A Closed-Form Analytical Description. IEEE Antennas and Wireless Propagation Letters, 2018, roč. 17, č. 9, s. 1656-1658. ISSN: 1536-1225.
Detail

ŠTUMPF, M. Evaluating the Ground Impedance -- A New Methodology Based on EM Reciprocity. IEEE Transaction on Electromagnetic Compatibility, 2018, vol. 61, no. 3, p. 1-7. ISSN: 0018-9375.
Detail

KADLEC, P.; MAREK, M.; ŠTUMPF, M.; ŠEDĚNKA, V. PCB Decoupling Optimization with Variable Number of Capacitors. IEEE Transaction on Electromagnetic Compatibility, 2018, vol. 20, no. 4, p. 1-8. ISSN: 0018-9375.
Detail

ŠTUMPF, M. Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition. In Proceedings of The 2017 IEEE International Symposium on Electromagnetic Compatibility. Washington, D.C, USA: IEEE EMC Society, 2017. p. 751-755. ISBN: 978-1-5386-2230-8.
Detail

ŠEDĚNKA, V.; ŠTUMPF, M.; KADLEC, P.;: TD-PCBSv1; Time Domain Printed Circuit Board Solver. PC-489. URL: http://www.urel.feec.vutbr.cz/web_documents/produkty/2018/TD-PCBS_SW_CZ.pdf. (software)
Detail