Publication detail

Evaluating the Ground Impedance-A New Methodology Based on EM Reciprocity

ŠTUMPF, M.

Original Title

Evaluating the Ground Impedance-A New Methodology Based on EM Reciprocity

Type

journal article in Web of Science

Language

English

Original Abstract

The electromagnetic reciprocity theorem of the time-convolution type is applied to introduce a general methodology for constructing approximate expressions for the ground impedance parameter. The methodology is first illustrated on expressing the ground impedance concerning a thin conductive strip above a homogeneous, lossy half-space, which yields the classic ground-impedance approximate expressions due to Carson and Vance. Second, the proposed methodology is applied to the corresponding strip-ground configuration in which the effect of the ground is modeled via the surface impedance approximation. This leads to a new ground-impedance approximate expression given in terms of the exponential integral. The validity of the latter approximation is assessed numerically and its relation to the well-known approximations is briefly discussed. Finally, the corresponding two-layer ground problem configuration is analyzed. The result is a correction of the ground impedance accounting for the contrast in soil stratification.

Keywords

Electromagnetic reciprocity; ground impedance.

Authors

ŠTUMPF, M.

Released

3. 6. 2019

Publisher

IEEE EMC Society

Location

Piscataway, NJ, USA

ISBN

0018-9375

Periodical

IEEE Transaction on Electromagnetic Compatibility

Year of study

61

Number

3

State

United States of America

Pages from

928

Pages to

934

Pages count

7

URL

https://ieeexplore.ieee.org/document/8370085/

BibTex

@article{BUT149733,
  author="Martin {Štumpf}",
  title="Evaluating the Ground Impedance-A New Methodology Based on EM Reciprocity",
  journal="IEEE Transaction on Electromagnetic Compatibility",
  year="2019",
  volume="61",
  number="3",
  pages="928--934",
  doi="10.1109/TEMC.2018.2833285",
  issn="0018-9375",
  url="https://ieeexplore.ieee.org/document/8370085/"
}