Detail publikace

The Increasing Importance of the Thermal Management for Modern Electronic Packages

Originální název

The Increasing Importance of the Thermal Management for Modern Electronic Packages

Anglický název

The Increasing Importance of the Thermal Management for Modern Electronic Packages

Jazyk

en

Originální abstrakt

This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.

Anglický abstrakt

This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.

BibTex


@article{BUT96451,
  author="Boleslav {Psota} and Ivan {Szendiuch}",
  title="The Increasing Importance of the Thermal Management for Modern Electronic Packages",
  annote="This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.",
  address="Fakulta Elektrotechnická ZČU v Plzni",
  chapter="96451",
  institution="Fakulta Elektrotechnická ZČU v Plzni",
  number="VI.",
  volume="2012",
  year="2012",
  month="december",
  pages="1--5",
  publisher="Fakulta Elektrotechnická ZČU v Plzni",
  type="journal article"
}