Detail publikace

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Originální název

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Anglický název

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Jazyk

en

Originální abstrakt

This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.

Anglický abstrakt

This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.

BibTex


@inproceedings{BUT95801,
  author="Michal {Nicák} and Boleslav {Psota} and Petr {Kosina} and Jiří {Starý} and Josef {Šandera}",
  title="PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS",
  annote="This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.",
  address="Ing. Vladislav Novotný - Litera",
  booktitle="Electronics Devices and Systems 2012",
  chapter="95801",
  edition="1",
  howpublished="online",
  institution="Ing. Vladislav Novotný - Litera",
  year="2012",
  month="june",
  pages="245--251",
  publisher="Ing. Vladislav Novotný - Litera",
  type="conference paper"
}