Detail publikace

Lead-free Soldering - when will be comming?

Originální název

Lead-free Soldering - when will be comming?

Anglický název

Lead-free Soldering - when will be comming?

Jazyk

en

Originální abstrakt

The first supposed date for replacing of lead-solders was January 1, 2004. We all can see that the reality is still distant and nobody is sure that it will be actually announced year 2006. There is no current definition of lead-free in electronics industry. However based on environmental restrictions, manufacturer requirements and industrial practice, the amount of lead contained in a lead-free alloy should be less than 0.1%. A large number of lead-free solders have been developed and applications have been made for over 100 patents on various alloy compositions. Although not all these alloys are commercially available there is still a wide range to choose from. Unfortunately within this range of lead-free solders, there is no absolute drop-in replacement for tin-lead alloy. It other words there is no lead-free alloy with the same melting temperature, wetting, cost and strength properties.

Anglický abstrakt

The first supposed date for replacing of lead-solders was January 1, 2004. We all can see that the reality is still distant and nobody is sure that it will be actually announced year 2006. There is no current definition of lead-free in electronics industry. However based on environmental restrictions, manufacturer requirements and industrial practice, the amount of lead contained in a lead-free alloy should be less than 0.1%. A large number of lead-free solders have been developed and applications have been made for over 100 patents on various alloy compositions. Although not all these alloys are commercially available there is still a wide range to choose from. Unfortunately within this range of lead-free solders, there is no absolute drop-in replacement for tin-lead alloy. It other words there is no lead-free alloy with the same melting temperature, wetting, cost and strength properties.

BibTex


@inproceedings{BUT9233,
  author="Ivan {Szendiuch}",
  title="Lead-free Soldering - when will be comming?",
  annote="The first supposed date for replacing of lead-solders was January 1, 2004. We all can see that the reality is still distant and nobody is sure that it will be actually announced year 2006. There is no current definition of lead-free in electronics industry. However based on environmental restrictions, manufacturer requirements and industrial practice, the amount of lead contained in a lead-free alloy should be less than 0.1%. A large number of lead-free solders have been developed and applications have been made for over 100 patents on various alloy compositions. Although not all these alloys are commercially available there is still a wide range to choose from. Unfortunately within this range of lead-free solders, there is no absolute drop-in replacement for tin-lead alloy. It other words there is no lead-free alloy with the same melting temperature, wetting, cost and strength properties.",
  address="Technological Institute of Crete",
  booktitle="Proceedings of the Socrates Workshop 2003",
  chapter="9233",
  institution="Technological Institute of Crete",
  year="2003",
  month="september",
  pages="61",
  publisher="Technological Institute of Crete",
  type="conference paper"
}