Detail publikace

HEAT TRANSFER ON FALLING FILM TUBE BUNDLE

Originální název

HEAT TRANSFER ON FALLING FILM TUBE BUNDLE

Anglický název

HEAT TRANSFER ON FALLING FILM TUBE BUNDLE

Jazyk

en

Originální abstrakt

The bundle of horizontal tubes in atmospheric pressure was used for parametrical studies focused on expression of relationship between horizontal tube spacing and falling film formation and the heat transfer rate. Backsplash characteristic was measured on the experimental tube bundle. The heat transfer coefficient was used as major indication of falling film characteristic reflecting qualitative changes in falling film formation.

Anglický abstrakt

The bundle of horizontal tubes in atmospheric pressure was used for parametrical studies focused on expression of relationship between horizontal tube spacing and falling film formation and the heat transfer rate. Backsplash characteristic was measured on the experimental tube bundle. The heat transfer coefficient was used as major indication of falling film characteristic reflecting qualitative changes in falling film formation.

Dokumenty

BibTex


@inproceedings{BUT92215,
  author="Jiří {Pospíšil} and Zdeněk {Fortelný}",
  title="HEAT TRANSFER ON FALLING FILM TUBE BUNDLE",
  annote="The bundle of horizontal tubes in atmospheric pressure was used for parametrical studies focused on expression of relationship between horizontal tube spacing and falling film formation and the heat transfer rate. Backsplash characteristic was measured on the experimental tube bundle. The heat transfer coefficient was used as major indication of falling film characteristic reflecting qualitative changes in falling film formation.",
  address="Budapest University of Technology and Economist",
  booktitle="Proceedings of the Eighth International Conference on Mechanical Engineering",
  chapter="92215",
  edition="1",
  howpublished="print",
  institution="Budapest University of Technology and Economist",
  year="2012",
  month="may",
  pages="451--456",
  publisher="Budapest University of Technology and Economist",
  type="conference paper"
}