Detail publikace

Influence of Bump Height to Multisubstrate Structures Construction

Originální název

Influence of Bump Height to Multisubstrate Structures Construction

Anglický název

Influence of Bump Height to Multisubstrate Structures Construction

Jazyk

en

Originální abstrakt

This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.

Anglický abstrakt

This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.

BibTex


@inproceedings{BUT8128,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Influence of Bump Height to Multisubstrate Structures Construction",
  annote="This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.",
  address="Ing. Zdeněk Novotný CSc., Brno",
  booktitle="Proceedings of 10-th Electronic Devices and Systems Conference 2003",
  chapter="8128",
  edition="Neuveden",
  institution="Ing. Zdeněk Novotný CSc., Brno",
  year="2003",
  month="january",
  pages="377",
  publisher="Ing. Zdeněk Novotný CSc., Brno",
  type="conference paper"
}