Detail publikace

Influence of Bump Height to Multisubstrate Structures Construction

BULVA, J., SZENDIUCH, I.

Originální název

Influence of Bump Height to Multisubstrate Structures Construction

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.

Klíčová slova v angličtině

ANSYS, MSM, modelling, thermomechanical properties

Autoři

BULVA, J., SZENDIUCH, I.

Rok RIV

2003

Vydáno

1. 1. 2003

Nakladatel

Ing. Zdeněk Novotný CSc., Brno

Místo

Brno

ISBN

80-214-2452-4

Kniha

Proceedings of 10-th Electronic Devices and Systems Conference 2003

Edice

Neuveden

Číslo edice

Neuveden

Strany od

377

Strany do

381

Strany počet

5

BibTex

@inproceedings{BUT8128,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Influence of Bump Height to Multisubstrate Structures Construction",
  booktitle="Proceedings of 10-th Electronic Devices and Systems Conference 2003",
  year="2003",
  series="Neuveden",
  volume="Neuveden",
  number="Neuveden",
  pages="5",
  publisher="Ing. Zdeněk Novotný CSc., Brno",
  address="Brno",
  isbn="80-214-2452-4"
}