Detail publikace

Odborný posudek:IEC 61190-1-2 Ed. 2: Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly

STARÝ, J.

Originální název

Odborný posudek:IEC 61190-1-2 Ed. 2: Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly

Český název

Odborný posudek:IEC 61190-1-2 Ed. 2: Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly

Typ

norma

Jazyk

cs

Vydáno

02.03.2006

Strany od

1

Strany do

3

Strany počet

3

Dokumenty

BibTex


@misc{BUT68189,
  author="Jiří {Starý}",
  title="Odborný posudek:IEC 61190-1-2 Ed. 2: Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly",
  chapter="68189",
  year="2006",
  month="march",
  pages="1",
  type="standard"
}