Publication detail

Odborný posudek:IEC 61190-1-2 Ed. 2: Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly

STARÝ, J.

Original Title

Odborný posudek:IEC 61190-1-2 Ed. 2: Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly

Type

standard

Language

Czech

Authors

STARÝ, J.

Released

2. 3. 2006

Pages from

1

Pages to

3

Pages count

3

BibTex

@misc{BUT68189,
  author="Jiří {Starý}",
  title="Odborný posudek:IEC 61190-1-2 Ed. 2: Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly",
  year="2006",
  pages="3",
  note="standard"
}