Detail publikace

Odborný posudek: IEC 60068-2-69 Ed 2: Environmental Testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (2006/01)

Originální název

Odborný posudek: IEC 60068-2-69 Ed 2: Environmental Testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (2006/01)

Anglický název

Odborný posudek: IEC 60068-2-69 Ed 2: Environmental Testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (2006/01)

Jazyk

en

BibTex


@misc{BUT68186,
  author="Jiří {Starý}",
  title="Odborný posudek: IEC 60068-2-69 Ed 2: Environmental Testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (2006/01)",
  chapter="68186",
  year="2006",
  month="january",
  pages="1",
  type="standard"
}