Detail publikace

Odborný posudek: IEC 60068-2-58 Ed.3:Enviromental testing - test Td- Test method for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices.

Originální název

Odborný posudek: IEC 60068-2-58 Ed.3:Enviromental testing - test Td- Test method for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices.

Anglický název

Odborný posudek: IEC 60068-2-58 Ed.3:Enviromental testing - test Td- Test method for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices.

Jazyk

en

BibTex


@misc{BUT67725,
  author="Jiří {Starý}",
  title="Odborný posudek: IEC 60068-2-58 Ed.3:Enviromental testing - test Td- Test method for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices.",
  chapter="67725",
  year="2002",
  month="october",
  type="standard"
}