Detail publikace

Contribution to realization of 3D structures

NICÁK, M. SZENDIUCH, I.

Originální název

Contribution to realization of 3D structures

Typ

abstrakt

Jazyk

angličtina

Originální abstrakt

This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).

Klíčová slova

Lead-free solder, solder joint, Al2O3, LTCC

Autoři

NICÁK, M.; SZENDIUCH, I.

Vydáno

12. 5. 2010

Nakladatel

Oficyna Wydawnicza Politechniki Warszawskiej

Místo

Warsaw, Poland

ISBN

978-83-7207-870-4

Kniha

Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.

Číslo edice

1

Strany od

110

Strany do

111

Strany počet

2

BibTex

@misc{BUT60945,
  author="Michal {Nicák} and Ivan {Szendiuch}",
  title="Contribution to realization of 3D structures",
  booktitle="Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.",
  year="2010",
  edition="1",
  pages="110--111",
  publisher="Oficyna Wydawnicza Politechniki Warszawskiej",
  address="Warsaw, Poland",
  isbn="978-83-7207-870-4",
  note="abstract"
}