Detail publikace

On the Application of Solder Balls for 3D Packaging

Originální název

On the Application of Solder Balls for 3D Packaging

Anglický název

On the Application of Solder Balls for 3D Packaging

Jazyk

en

Originální abstrakt

Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations

Anglický abstrakt

Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations

BibTex


@article{BUT50612,
  author="Ivan {Szendiuch} and Michal {Nicák}",
  title="On the Application of Solder Balls for 3D Packaging",
  annote="Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations",
  address="E.G.Leuze Verlag KG",
  chapter="50612",
  institution="E.G.Leuze Verlag KG",
  journal="PLUS",
  number="8",
  volume="2010",
  year="2010",
  month="august",
  pages="1855--1860",
  publisher="E.G.Leuze Verlag KG",
  type="journal article - other"
}