Detail publikace

Methods of Chip Interconnection

Originální název

Methods of Chip Interconnection

Anglický název

Methods of Chip Interconnection

Jazyk

en

Originální abstrakt

This paper describes defferent methods of chip interconnection. (Bumps, wire bonding).

Anglický abstrakt

This paper describes defferent methods of chip interconnection. (Bumps, wire bonding).

BibTex


@inproceedings{BUT25296,
  author="Marek {Novotný} and Ivan {Szendiuch}",
  title="Methods of Chip Interconnection",
  annote="This paper describes defferent methods of chip interconnection. (Bumps, wire bonding).",
  address="Ing. Zdeněk Novotný CSc.",
  booktitle="Electronics Devices and Systems 07 Proceedings",
  chapter="25296",
  institution="Ing. Zdeněk Novotný CSc.",
  year="2007",
  month="january",
  pages="260--264",
  publisher="Ing. Zdeněk Novotný CSc.",
  type="conference paper"
}