Detail publikace

Wire Bonding Power Interconnection

Originální název

Wire Bonding Power Interconnection

Anglický název

Wire Bonding Power Interconnection

Jazyk

en

Originální abstrakt

This work describes chip interconnection. Especially thermomechanical stressing of these structures.

Anglický abstrakt

This work describes chip interconnection. Especially thermomechanical stressing of these structures.

BibTex


@inproceedings{BUT23962,
  author="Marek {Novotný} and Tomáš {Dvořák} and Ivan {Szendiuch}",
  title="Wire Bonding Power Interconnection",
  annote="This work describes chip interconnection. Especially thermomechanical stressing of these structures.",
  booktitle="Proceedings EMPC 2007 the 16th European Microelectronics and Packaging Conference & Exhibition, Part one",
  chapter="23962",
  year="2007",
  month="january",
  pages="92--94",
  type="conference paper"
}