Detail publikace

Investigation of solder joints strength

Originální název

Investigation of solder joints strength

Anglický název

Investigation of solder joints strength

Jazyk

en

Originální abstrakt

This paper deals with method for finding mechanical properties of solder joint. Basic aim is practical realization one’s select method namely shear strength finish of solder joint and their thermal fatigue variants on ceramic substrate. The test is execution on testing components soldered by tin-lead and lead-free solder. Acquired characteristic can subserve to definition influencing factors of strength and reliability soldered joint on ceramic substrate, primarily soldered by lead-free solder.

Anglický abstrakt

This paper deals with method for finding mechanical properties of solder joint. Basic aim is practical realization one’s select method namely shear strength finish of solder joint and their thermal fatigue variants on ceramic substrate. The test is execution on testing components soldered by tin-lead and lead-free solder. Acquired characteristic can subserve to definition influencing factors of strength and reliability soldered joint on ceramic substrate, primarily soldered by lead-free solder.

BibTex


@inproceedings{BUT18549,
  author="Cyril {Vaško} and Ivan {Szendiuch}",
  title="Investigation of solder joints strength",
  annote="This paper deals with method for finding mechanical properties of solder joint. Basic aim is practical realization one’s select method namely shear strength finish of solder joint and their thermal fatigue variants on ceramic substrate. The test is execution on testing components soldered by tin-lead and lead-free solder. Acquired characteristic can subserve to definition influencing factors of strength and reliability soldered joint on ceramic substrate, primarily soldered by lead-free solder.",
  address="TU Dresden",
  booktitle="ISSE 2006 Proceeding",
  chapter="18549",
  institution="TU Dresden",
  year="2006",
  month="may",
  pages="123",
  publisher="TU Dresden",
  type="conference paper"
}