Detail publikace

Three ways to ceramic packages

Originální název

Three ways to ceramic packages

Anglický název

Three ways to ceramic packages

Jazyk

en

Originální abstrakt

This paper is focused on ceramic packaging primarily on the technology of creation. The first part is about ceramic packages and aluminium oxide in general. This paper shows three technologies of ceramic package creation. The first one is ceramic powder pressing. The second one is high temperature co-fired ceramic. The third one is ceramic mold casting. The paper describes issues of creation and shows inspection with a figure from scanning electron microscope. The last part is focused on thick film printing and finalization of the ceramic package.

Anglický abstrakt

This paper is focused on ceramic packaging primarily on the technology of creation. The first part is about ceramic packages and aluminium oxide in general. This paper shows three technologies of ceramic package creation. The first one is ceramic powder pressing. The second one is high temperature co-fired ceramic. The third one is ceramic mold casting. The paper describes issues of creation and shows inspection with a figure from scanning electron microscope. The last part is focused on thick film printing and finalization of the ceramic package.

BibTex


@inproceedings{BUT138532,
  author="Josef {Skácel} and Ivan {Szendiuch}",
  title="Three ways to ceramic packages",
  annote="This paper is focused on ceramic packaging primarily on the technology of creation. The first part is about ceramic packages and aluminium oxide in general. This paper shows three technologies of ceramic package creation. The first one is ceramic powder pressing. The second one is high temperature co-fired ceramic. The third one is ceramic mold casting. The paper describes issues of creation and shows inspection with a figure from scanning electron microscope. The last part is focused on thick film printing and finalization of the ceramic package.",
  address="IEEE Computer Society",
  booktitle="Electronics Technology (ISSE), 2017 40th International Spring Seminar on",
  chapter="138532",
  doi="10.1109/ISSE.2017.8000919",
  edition="Volume 2017-September",
  howpublished="electronic, physical medium",
  institution="IEEE Computer Society",
  number="1",
  year="2017",
  month="august",
  pages="249--254",
  publisher="IEEE Computer Society",
  type="conference paper"
}