Detail publikace

Inovativní metody v procesu aktivace před pokovením průchozích děr

OTÁHAL, A. ŠIMEK, V. CRHA, A. RŮŽIČKA, R. SZENDIUCH, I.

Originální název

Innovative Methods in Activation Process of Through-hole Plating

Český název

Inovativní metody v procesu aktivace před pokovením průchozích děr

Anglický název

Innovative Methods in Activation Process of Through-hole Plating

Typ

článek v časopise

Jazyk

en

Originální abstrakt

This paper is dealing with an in-depth verification of innovated activation methods, where the phase of surface treatment involves solvent with oxides of carbon as the core chemistry. The overall impact of solvent on through-hole copper plating process was tested on target t structures involving standard FR-4 PCB substrate. The novelty of the approach proposed here is based on the effect of an unusual combination of vacuum and ultrasound waves in order to enhance quality of the activation process. The results undoubtedly demonstrated significant benefits of vacuum and vacuum/ultrasound combination on the decreasing number of defects, which normally occurred during the conventional plating process. In addition, there was also discovered that the resulting number of failures was increased even despite the use of ultrasound.

Český abstrakt

Příspěvek se zabývá důkladným ověřením inovovaných metod aktivace, kde fáze úpravy povrchu zahrnuje jako základní chemikálii roztok s oxidy uhlíku. Celkový dopad rozpouštědla na průchod mědění proces byl testován na cílové struktury zahrnující standardní DPS subtstráty z FR-4. Novost tohoto navrženého přístupu je založena na působení neobvyklé kombinace vakua a ultrazvukových vln s cílem zvýšit kvalitu procesu aktivace. Výsledky nepochybně prokázaly významného zlepšení při použití kombinace vakua a vakuum/ultrazvuk na snižující se počet závad, ke kterému standardně docházelo během procesu konvenčního procesu pokovování. Kromě toho bylo také zjištěno, že výsledný počet defektů byl zvýšen při použití samotného ultrazvuku.

Anglický abstrakt

This paper is dealing with an in-depth verification of innovated activation methods, where the phase of surface treatment involves solvent with oxides of carbon as the core chemistry. The overall impact of solvent on through-hole copper plating process was tested on target t structures involving standard FR-4 PCB substrate. The novelty of the approach proposed here is based on the effect of an unusual combination of vacuum and ultrasound waves in order to enhance quality of the activation process. The results undoubtedly demonstrated significant benefits of vacuum and vacuum/ultrasound combination on the decreasing number of defects, which normally occurred during the conventional plating process. In addition, there was also discovered that the resulting number of failures was increased even despite the use of ultrasound.

Klíčová slova

pokovené průchozí díry, aktivace DPS, reverzní pulzní pokovení, vakuum, ultrazvuk

Vydáno

07.09.2016

Nakladatel

Periodica Polytechnica Electrical Engineering and Computer Science

Strany od

217

Strany do

222

Strany počet

6

URL

BibTex


@article{BUT128064,
  author="Alexandr {Otáhal} and Václav {Šimek} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch}",
  title="Innovative Methods in Activation Process of Through-hole Plating",
  annote="This paper is dealing with an in-depth verification of innovated activation methods, where the phase of surface treatment involves solvent with oxides of carbon as the core chemistry. The overall impact of solvent on through-hole copper plating process was tested on target t structures involving standard FR-4 PCB substrate. The novelty of the approach proposed here is based on the effect of an unusual combination of vacuum and ultrasound waves in order to enhance quality of the activation process. The results undoubtedly demonstrated significant benefits of vacuum and vacuum/ultrasound combination on the decreasing number of defects, which normally occurred during the conventional plating process. In addition, there was also discovered that the resulting number of failures was increased even despite the use of ultrasound.",
  address="Periodica Polytechnica Electrical Engineering and Computer Science",
  chapter="128064",
  doi="10.3311/PPee.9686",
  howpublished="online",
  institution="Periodica Polytechnica Electrical Engineering and Computer Science",
  number="4",
  volume="60",
  year="2016",
  month="september",
  pages="217--222",
  publisher="Periodica Polytechnica Electrical Engineering and Computer Science",
  type="journal article"
}