Detail publikace

Solder Wetting of Substrate Surface in Lead Free Soldering

Originální název

Solder Wetting of Substrate Surface in Lead Free Soldering

Anglický název

Solder Wetting of Substrate Surface in Lead Free Soldering

Jazyk

en

Originální abstrakt

Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis on different substrates

Anglický abstrakt

Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis on different substrates

Dokumenty

BibTex


@inproceedings{BUT12620,
  author="Jiří {Starý} and Jiří {Kazelle}",
  title="Solder Wetting of Substrate Surface in Lead Free Soldering",
  annote="Soldering process containing lead  will be substituted by lead-free since 2006. It is provided by ecological norms  (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be   compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area
	This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis on different substrates",
  address="VUT v Brně",
  booktitle="The 11th Electronic Devices and Systems Conference",
  chapter="12620",
  institution="VUT v Brně",
  year="2004",
  month="june",
  pages="394",
  publisher="VUT v Brně",
  type="conference paper"
}