Detail publikace
Solder Wetting of Substrate Surface in Lead Free Soldering
Originální název
Solder Wetting of Substrate Surface in Lead Free Soldering
Anglický název
Solder Wetting of Substrate Surface in Lead Free Soldering
Jazyk
en
Originální abstrakt
Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis on different substrates
Anglický abstrakt
Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis on different substrates
Dokumenty
BibTex
@inproceedings{BUT12620,
author="Jiří {Starý} and Jiří {Kazelle}",
title="Solder Wetting of Substrate Surface in Lead Free Soldering",
annote="Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area
This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis on different substrates",
address="VUT v Brně",
booktitle="The 11th Electronic Devices and Systems Conference",
chapter="12620",
institution="VUT v Brně",
year="2004",
month="june",
pages="394",
publisher="VUT v Brně",
type="conference paper"
}