Detail publikace

Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis

Originální název

Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis

Anglický název

Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis

Jazyk

en

Originální abstrakt

This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used.

Anglický abstrakt

This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used.

BibTex


@inproceedings{BUT118145,
  author="Boleslav {Psota} and Ivan {Szendiuch} and Alexandr {Otáhal}",
  title="Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis",
  annote="This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used.",
  booktitle="Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition",
  chapter="118145",
  howpublished="online",
  year="2015",
  month="september",
  pages="1--4",
  type="conference paper"
}