Publication detail

Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis

PSOTA, B. SZENDIUCH, I. OTÁHAL, A.

Original Title

Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis

English Title

Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis

Type

conference paper

Language

en

Original Abstract

This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used.

English abstract

This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used.

Keywords

Simulation; PCB; design; ANSYS

RIV year

2015

Released

14.09.2015

ISBN

978-0-9568086-1-5

Book

Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition

Pages from

1

Pages to

4

Pages count

4

URL

BibTex


@inproceedings{BUT118145,
  author="Boleslav {Psota} and Ivan {Szendiuch} and Alexandr {Otáhal}",
  title="Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis",
  annote="This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used.",
  booktitle="Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition",
  chapter="118145",
  howpublished="online",
  year="2015",
  month="september",
  pages="1--4",
  type="conference paper"
}