Detail publikace

Vapour deposition on LTCC for 3D structure

Originální název

Vapour deposition on LTCC for 3D structure

Anglický název

Vapour deposition on LTCC for 3D structure

Jazyk

en

Originální abstrakt

Paper deals with an area of thin film layers made for LTCC interconnections. The thin layers were realized using physical vapour deposition (thin film technology). Cooper and silver were used for deposition. Cooper thin film layer properties were affected adversely by sintering but the silver thin film layer was unaffected without any change of parameters. The deposited thin film layers on the LTCC substrate were tested for reliability using current loading. The possibility of deposited layers ultrasonic wire bonding and interconnection were tested and discussed too.

Anglický abstrakt

Paper deals with an area of thin film layers made for LTCC interconnections. The thin layers were realized using physical vapour deposition (thin film technology). Cooper and silver were used for deposition. Cooper thin film layer properties were affected adversely by sintering but the silver thin film layer was unaffected without any change of parameters. The deposited thin film layers on the LTCC substrate were tested for reliability using current loading. The possibility of deposited layers ultrasonic wire bonding and interconnection were tested and discussed too.

BibTex


@article{BUT47201,
  author="Petr {Kosina} and Edita {Hejátková} and Josef {Šandera}",
  title="Vapour deposition on LTCC for 3D structure",
  annote="Paper deals with an area of thin film layers made for LTCC interconnections. The thin layers were realized using physical vapour deposition (thin film technology). Cooper and silver were used for deposition. Cooper thin film layer properties were affected adversely by sintering but the silver thin film layer was unaffected without any change of parameters. The deposited thin film layers on the LTCC substrate were tested for reliability using current loading. The possibility of deposited layers ultrasonic wire bonding and interconnection were tested and discussed too.",
  address="TU - Sofia",
  chapter="47201",
  institution="TU - Sofia",
  journal="Electronics",
  number="1",
  volume="2008",
  year="2008",
  month="september",
  pages="115--120",
  publisher="TU - Sofia",
  type="journal article - other"
}