Publication detail

Vapour deposition on LTCC for 3D structure

KOSINA, P. HEJÁTKOVÁ, E. ŠANDERA, J.

Original Title

Vapour deposition on LTCC for 3D structure

English Title

Vapour deposition on LTCC for 3D structure

Type

journal article

Language

en

Original Abstract

Paper deals with an area of thin film layers made for LTCC interconnections. The thin layers were realized using physical vapour deposition (thin film technology). Cooper and silver were used for deposition. Cooper thin film layer properties were affected adversely by sintering but the silver thin film layer was unaffected without any change of parameters. The deposited thin film layers on the LTCC substrate were tested for reliability using current loading. The possibility of deposited layers ultrasonic wire bonding and interconnection were tested and discussed too.

English abstract

Paper deals with an area of thin film layers made for LTCC interconnections. The thin layers were realized using physical vapour deposition (thin film technology). Cooper and silver were used for deposition. Cooper thin film layer properties were affected adversely by sintering but the silver thin film layer was unaffected without any change of parameters. The deposited thin film layers on the LTCC substrate were tested for reliability using current loading. The possibility of deposited layers ultrasonic wire bonding and interconnection were tested and discussed too.

Keywords

LTCC, thin film, thick film, 3D structure

RIV year

2008

Released

24.09.2008

Publisher

TU - Sofia

Location

Sozopol, Bulgaria

Pages from

115

Pages to

120

Pages count

6

BibTex


@article{BUT47201,
  author="Petr {Kosina} and Edita {Hejátková} and Josef {Šandera}",
  title="Vapour deposition on LTCC for 3D structure",
  annote="Paper deals with an area of thin film layers made for LTCC interconnections. The thin layers were realized using physical vapour deposition (thin film technology). Cooper and silver were used for deposition. Cooper thin film layer properties were affected adversely by sintering but the silver thin film layer was unaffected without any change of parameters. The deposited thin film layers on the LTCC substrate were tested for reliability using current loading. The possibility of deposited layers ultrasonic wire bonding and interconnection were tested and discussed too.",
  address="TU - Sofia",
  chapter="47201",
  institution="TU - Sofia",
  journal="Electronics",
  number="1",
  volume="2008",
  year="2008",
  month="september",
  pages="115--120",
  publisher="TU - Sofia",
  type="journal article"
}