Detail publikace

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

NICÁK, M. SZENDIUCH, I.

Originální název

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

Anglický název

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

Jazyk

en

Originální abstrakt

This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.

Anglický abstrakt

This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.

Dokumenty

BibTex 


@inproceedings{BUT33965,
  author="Michal {Nicák} and Ivan {Szendiuch}",
  title="CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES",
  annote="This paper describes design, construction and some test results of lead-free
soldered three dimensional structures based on combination of stacked thick-film
Al2O3 and FR-4 substrates. These various substrate configurations are realized in
two ways, at first by lead-free solder bumps made by solder paste stencil printing,
and at second by bumps using combination of paste and solder balls.",
  address="Publishing House of ISTU",
  booktitle="Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings",
  chapter="33965",
  howpublished="print",
  institution="Publishing House of ISTU",
  year="2010",
  month="april",
  pages="378--382",
  publisher="Publishing House of ISTU",
  type="conference paper"
}