Publication detail

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

NICÁK, M. SZENDIUCH, I.

Original Title

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

English Title

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

Type

conference paper

Language

en

Original Abstract

This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.

English abstract

This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.

Keywords

packaging, stacking, 3D structures, lead-free, thick-film

RIV year

2010

Released

22.04.2010

Publisher

Publishing House of ISTU

Location

Izhevsk, Russia

ISBN

978-5-7526-0442-3

Book

Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings

Pages from

378

Pages to

382

Pages count

444

BibTex


@inproceedings{BUT33965,
  author="Michal {Nicák} and Ivan {Szendiuch}",
  title="CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES",
  annote="This paper describes design, construction and some test results of lead-free
soldered three dimensional structures based on combination of stacked thick-film
Al2O3 and FR-4 substrates. These various substrate configurations are realized in
two ways, at first by lead-free solder bumps made by solder paste stencil printing,
and at second by bumps using combination of paste and solder balls.",
  address="Publishing House of ISTU",
  booktitle="Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings",
  chapter="33965",
  howpublished="print",
  institution="Publishing House of ISTU",
  year="2010",
  month="april",
  pages="378--382",
  publisher="Publishing House of ISTU",
  type="conference paper"
}