Publication detail
CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES
NICÁK, M. SZENDIUCH, I.
Original Title
CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES
English Title
CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES
Type
conference paper
Language
en
Original Abstract
This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.
English abstract
This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.
Keywords
packaging, stacking, 3D structures, lead-free, thick-film
RIV year
2010
Released
22.04.2010
Publisher
Publishing House of ISTU
Location
Izhevsk, Russia
ISBN
978-5-7526-0442-3
Book
Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings
Pages from
378
Pages to
382
Pages count
444
BibTex
@inproceedings{BUT33965,
author="Michal {Nicák} and Ivan {Szendiuch}",
title="CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES",
annote="This paper describes design, construction and some test results of lead-free
soldered three dimensional structures based on combination of stacked thick-film
Al2O3 and FR-4 substrates. These various substrate configurations are realized in
two ways, at first by lead-free solder bumps made by solder paste stencil printing,
and at second by bumps using combination of paste and solder balls.",
address="Publishing House of ISTU",
booktitle="Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings",
chapter="33965",
howpublished="print",
institution="Publishing House of ISTU",
year="2010",
month="april",
pages="378--382",
publisher="Publishing House of ISTU",
type="conference paper"
}