Detail publikace

The technology of ceramic packages

SKÁCEL, J.

Originální název

The technology of ceramic packages

Anglický název

The technology of ceramic packages

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

čeština

Originální abstrakt

Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.

Anglický abstrakt

Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.

Klíčová slova

ceramic, packaging, sintering, simulation

Klíčová slova v angličtině

ceramic, packaging, sintering, simulation

Autoři

SKÁCEL, J.

Vydáno

23. 4. 2017

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Místo

Brno

ISBN

978-80-214-5496-5

Kniha

Proceedings of the 21st Conference STUDENT EEICT 2017

Strany od

542

Strany do

546

Strany počet

5

URL

http://eeict.feec.vutbr.cz/2017/sbornik/EEICT_2017-sbornik-komplet-2.pdf

BibTex

@inproceedings{BUT138534,
  author="Josef {Skácel}",
  title="The technology of ceramic packages",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2017",
  year="2017",
  pages="542--546",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  address="Brno",
  isbn="978-80-214-5496-5",
  url="http://eeict.feec.vutbr.cz/2017/sbornik/EEICT_2017-sbornik-komplet-2.pdf"
}