Publication detail

The technology of ceramic packages

SKÁCEL, J.

Original Title

The technology of ceramic packages

English Title

The technology of ceramic packages

Type

conference paper

Language

Czech

Original Abstract

Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.

English abstract

Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.

Keywords

ceramic, packaging, sintering, simulation

Key words in English

ceramic, packaging, sintering, simulation

Authors

SKÁCEL, J.

Released

23. 4. 2017

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Location

Brno

ISBN

978-80-214-5496-5

Book

Proceedings of the 21st Conference STUDENT EEICT 2017

Pages from

542

Pages to

546

Pages count

5

URL

http://eeict.feec.vutbr.cz/2017/sbornik/EEICT_2017-sbornik-komplet-2.pdf

BibTex

@inproceedings{BUT138534,
  author="Josef {Skácel}",
  title="The technology of ceramic packages",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2017",
  year="2017",
  pages="542--546",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  address="Brno",
  isbn="978-80-214-5496-5",
  url="http://eeict.feec.vutbr.cz/2017/sbornik/EEICT_2017-sbornik-komplet-2.pdf"
}