Publication detail

The technology of ceramic packages

Original Title

The technology of ceramic packages

Czech Title

The technology of ceramic packages

Language

cs

Original Abstract

Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.

Czech abstract

Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.

BibTex


@inproceedings{BUT138534,
  author="Josef {Skácel}",
  title="The technology of ceramic packages",
  annote="Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic
in general. The next part is focused on used material Nabaltec and advantages of this type of technology
i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages
of this technology step. The inspection was done by SEM pictures and shows the
difference between sintered and unsintered ceramic. The last part is a simulation with 120mW
power load and shows temperature distribution on the ceramic package compared with mold compound
as the packaging material.",
  address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2017",
  chapter="138534",
  howpublished="online",
  institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  year="2017",
  month="april",
  pages="542--546",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  type="conference paper"
}