Detail publikace

ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

VALA, M.

Originální název

ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

Český název

ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

Typ

článek ve sborníku

Jazyk

cs

Originální abstrakt

This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection.

Český abstrakt

This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection.

Klíčová slova

X-ray, Defect, Analysis, X-plane, Void

Vydáno

30.04.2016

ISBN

978-80-214-5350-0

Kniha

Proceedings of the 22nd Conference STUDENT EEICT 2016

Strany od

206

Strany do

208

Strany počet

789

URL

BibTex


@inproceedings{BUT130790,
  author="Martin {Vala}",
  title="ANALYSIS OF DEFECTS ON PCB USING X-RAY, 
3D SW CERA AND MICRO-SECTIONS",
  annote="This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection.",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  chapter="130790",
  howpublished="online",
  year="2016",
  month="april",
  pages="206--208",
  type="conference paper"
}